Clivet Unveils Magnetic-Bearing Compressor and Liquid Cooling Architecture at OCP Global Summit

Thermal engineering specialist Clivet, a flagship commercial brand of Midea Building Technologies, unveiled a next-generation magnetic-bearing centrifugal compressor and full-chain liquid cooling solution for artificial intelligence data centers at the 2026 Open Compute Project Global Summit in San Jose. Dr. Yunxiao Ding, Director of the Research Institute at Midea Building Technologies, delivered a keynote technical presentation detailing architectural innovations required to manage thermal loads inside high-density GPU server clusters. In recognition of the engineering breakthrough, summit organizers presented Clivet with the 2026 GW-Scale Open AIDC Excellent Technical Presentation Award.

Engineering specifications presented at the San Jose McEnery Convention Center demonstrate that Clivet's independent dual-shaft variable-speed drive architecture reduces compressor electrical power consumption by up to 40 percent while maintaining identical thermal cooling capacity. Furthermore, aerothermodynamic refinements allow the magnetic-bearing centrifugal unit to increase maximum inlet flow at low pressure ratios by approximately 70 percent, enabling effective heat rejection across wider ambient temperature ranges. Midea also appeared on the official participating partner roster for the NVIDIA MGX modular server ecosystem showcased on the summit exhibition floor.

Data center infrastructure operators and electrical grid planners across San Jose, Santa Clara, Livermore, and the Tri-Valley emphasized that thermal management has become a primary bottleneck for gigawatt-scale AI compute deployments. Traditional air-cooled chiller systems struggle to dissipate the extreme heat density generated by next-generation rack architectures without consuming unsustainable volumes of municipal water and grid electricity. By combining oil-free magnetic-bearing compression with direct-to-chip cold plate liquid loops, facility engineers can dramatically lower power usage effectiveness ratios and support regional environmental sustainability mandates.

Municipal utility commissions, county energy boards, and state environmental officials across the Bay Area have increasingly scrutinized data center power and water footprints during commercial permitting reviews. Hardware standardization committees within the Open Compute Project noted that open-specification liquid cooling components allow cloud service providers and regional colocation facilities to retrofit legacy server halls more rapidly. Collaborative validation within the NVIDIA MGX framework ensures that thermal manifolds and coolant distribution units align seamlessly with standardized server rack geometries.

Data center architects, mechanical engineers, and sustainability officers can review Clivet's full technical white papers and OCP specification sheets online at opencompute.org or clivet.com. Engineering representatives from Midea Building Technologies are conducting live hardware demonstrations at the San Carlos Street convention center in downtown San Jose through the conclusion of the summit program. Technical inquiries regarding commercial chiller deployments and custom liquid cooling loops can be directed to the company's North American engineering division.